The University of Wisconsin – Madison Snow Mold Field Day will be held on April 26th at Marquette CC in Marquette, MI. There will be an in-person version at 11:00 AM Eastern (10:00 AM Central) and a virtual version at 11:30 AM Eastern (10:30 AM Central).
For more details and to register for the virtual field day please visit the following website:
UW Snow Mold Field Day Information
The WinterTurf research group will be conducting a series of research projects on snow mold fungi to better understand how they infect turfgrass. We need your help to build a diverse collection of snow mold samples from different environments to use in our research! If you see snow mold on your course this spring, please consider sending us a sample to use in our research. Unfortunately at this point only domestic U.S. samples can be accepted, though we are working on the proper permitting to accept international samples. To submit a sample please follow the instructions on the ‘WinterTurf Snow Mold Submission Form’ and include the completed submission form along with your sample. Contact Paul Koch at firstname.lastname@example.org or 608-576-2673 if you have any questions.
To download the submission form please click on the following link: WinterTurfSnowMoldSubmission_DomesticForm
Please visit the following website to learn more about the WinterTurf Research Project: https://mailchi.mp/umn/winterturf-news
The 2021 Summer Disease Research Reports, including treatment pictures, are now available and ready for viewing. Click the following link to access the reports: https://tdl.wisc.edu/summer-2021-turfgrass-pathology-research/
The 2021 Snow Mold Reports, including treatment pictures, are now available and ready for viewing. Click the following link to access the reports: https://tdl.wisc.edu/2020-2021-snow-mold-fungicide-research-reports/
Our contract members are a critical part of the TDL’s success, and we greatly appreciate the support of 2020 TDL Contract Members. The full list of 2020 TDL Contract Members can be found by clicking here.